Advanced Configuration and Power Interface (ACPI): A Cross‑Layer Architecture for SoC Verification, Firmware Engineering, and Datacenter Power Management
Keywords:
ACPI, Datacenter Power Management, Firmware Engineering, SoC Verification, Thermal ManagementAbstract
Managing power and heat across modern computing systems is not a problem any single layer of the stack can solve on its own. Silicon design, firmware, operating system software, and data center infrastructure each carry a piece of the responsibility, and without a shared contract between them, the result is fragmentation that wastes energy and limits portability. This article examines how the Advanced Configuration and Power Interface establishes that contract and maintains it across a range of platforms. The discussion covers ACPI architecture, power and performance state definitions, thermal management, pre-silicon verification, firmware implementation, and datacenter-scale orchestration, with case studies drawn from mobile SoCs, enterprise servers, and accelerator-dense racks. The article closes by examining how AI-driven optimization, chiplet-native design, and cloud-native deployment requirements will shape how ACPI develops in the years ahead.
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